Filter: Manufacturer: Q - T   Remove All Design Interest 244   Process Interest 313   Layout and Benchmark 337     Manufacturer Qualcomm 10 SGS-Thomson 6 STMicroelectronics 62 Samsung 84 SanDisk 13 Sharp 19 Siemens 14 Sony 70 Texas Instruments 297 Toshiba 35     Device Category Analog and RF 46 Image Sensors 74 MEMS Devices 35 Memory 48 Microprocessors Microcontrollers DSP and similar 17 Microprocessors Microcontrollers DSP similar 43 Mixed Signal RF 8 Other 384 Power Management LCD Drivers and similar 42   61 more   Report Type Chiptease Report 37 Circuit Analysis Report 151 Device Identification Report 169 Exploratory Report 25 Functional Analysis Report 19 Imager Process Review 35 Process Node Assessment 14 Process Review 20 Product Teardown Report 29 Structural Analysis Report 129     Device Type ASIC 21 CMOS Image Sensor 65 DRAM 21 DSP 45 Flash 23 Microprocessor 25 Other 34 Preamplifier 20 SDRAM 24 SRAM 21   13 more   Published Year 1999 28 2000 26 2003 30 2004 40 2005 59 2006 54 2007 37 2008 216 2009 55 2010 45   167 more   Published Month January 210 February 43 March 47 April 43 May 41 June 43 August 59 September 42 November 58 December 55   8 more Extracted Schematics (Recent circuit analysis only) Analog (General) Converter ADC DAC Voltage - Current Voltage - Frequency Voltage - Temperature Clock Generator PLL - Clock DLL Pumps Charge pumps Bootstrapping circuit Oscillator VCO Ring Oscillator Crystal LC tank Filter Passive (RC,RL,LC,RLC) Active (Amplifier, Switch cap) SAW Switched-capacitor Reference Generator Current Voltage Bandgap Sensor Temperature RF Transceiver RFID Modulator/Demodulators LNA Mixer Power Amplifier Oscillator Frequency Synthesizer PLL - RF Equalizer Resonator Balun Power Supply Regulator Rectifier Buck Converter Boost Converter Buck/Boost Converter DC-DC Detector Transformer Power management   I/O ESD Buffers Input Output Bi-directional Transceivers SerDes PCI Serial ATA USB LVDS PHY SAS-SATA Fiberchannel PCIExpress JTAG MIPI DDR GDDR   Memory MEMORY Array Architecture Data Path Address Path Refresh Redundancy Control Circuit SRAM DRAM ROM Flash EEPROM Memory Controller EPROM OTP Fuse	Search All Reports Entire Collection Existing Results for in Search by full description Search by company and part # only < Previous  Results 1-25 of 702   Next > Toshiba THGBM2G6D2FBAIE 32 Gb MLC 32 nm NAND Flash  Structural Analysis Report (SAR-1009-801) Description: The THGBM2G6D2FBAIE 32 Gb MLC NAND Flash from Toshiba was built with the latest and smallest NAND... more...   Texas instruments OMAP3630 Application Processor  Functional Analysis Report (FAR-1008-801) Description: The Texas Instruments OMAP3630 was fabrictated at UMC in the 45 nm low power CMOS fab. The OMAP 3630... more...   Texas Instruments BQ29330 Die from the BQ20Z95  Process Review (PPR-1008-901) Description: The BQ20Z95 is a SBS-compliant gas gauge and protection IC designed for battery pack or in-system... more...   Texas Instruments bq20z95 (Die BQ29330) Gas Guage and Protectoin IC  Circuit Analysis Report (CAR-1010-902) Description: Upcoming ICWorks Browser Full Analog Schematics Organized and Analyzed Report of the Texas... more...   Texas Instruments BQ3060 (Die BQ8060) Battery Manager  Circuit Analysis Report (CAR-1010-901) Description: Upcoming ICWorks Browser report on Texas Instruments Die BQ8060 of BQ3060 Full Analog Schematics more...   Texas Instruments TPA4411RTJT Stereo Headphone Driver  Exploratory Report (EXR-1007-208) Description: Upcoming EXR on Texas Instruments TPA4411RT more...   Texas Instruments TPA2010D1YEF Audio Power Amplifier  Exploratory Report (EXR-1007-207) Description: Upcoming EXR on Texas Instruments TPA2010D1 more...   Texas Instruments TPA032D04DCA Audio Amplifier  Exploratory Report (EXR-1007-206) Description: Upcoming EXR on Texas Instruments TPA032D04 more...   STMicroelectronics L3G4200D MEMS Three-Axis Gyroscope  ICWorks Surveyor (ICS-1006-801) Description: The L3G4200D is a low-power, three-axis, gyroscope integrated into a 4 mm x 4 mm LGA package,... more...   STMicroelectronics L3G4200D MEMS Three-Axis Gyroscope  Exploratory Report (EXR-1006-802) Description: The L3G4200D is a low-power, three-axis, gyroscope integrated into a 4 mm x 4 mm LGA package,... more...   Texas Instruments / UMC XAM3715CBC 45 nm Application Processor  Package Analysis Report (PKG-1006-801) Description: The XAM3715 high-performance, applications processors are based on enhanced... more...   Texas Instruments / UMC XAM3715CBC 45 nm Application Processor  Functional Analysis Report (FAR-1006-804) Description: The XAM3715 high-performance, applications processors are based on enhanced... more...   Texas Instruments / UMC XAM3715CBC 45 nm Application Processor  Exploratory Report (EXR-1006-801) Description: The XAM3715 high-performance, applications processors are based on enhanced... more...   Texas Instruments / UMC XAM3715CBC 45 nm Application Processor  Structural Analysis Report (SAR-1007-801) Description: The XAM3715 high-performance, applications processors are based on enhanced... more...   Sony CXD2820R DVB Demodulator Basic Report Includes Memory Analysis  Functional Analysis Report (FAR-1006-901) Description: The CXD2820R is a DVB-T2 demodulator offering class-leading performance, optimized BOM requiring no... more...   Sony Second Generation BSI CIS IMX050  Circuit Analysis Report (CAR-1006-806) Description: The Sony IMX050 is a backside illuminated image sensor featuring 10.34M pixels wth a pixel size of... more...   Texas Instruments DAC9881 - HPA07 Process Technology  Process Review (PPR-1005-101) Description: Upcoming Process Reivew of the Texas Instruments DAC9881 - HPA07 Process more...   Skyworks SKY77186PA Module  Circuit Analysis Report (CAR-1005-905) Description: The SKY77186 PA module boasts a small size, high linearity and high efficiency for WCDMA/HSDPA... more...   Sony IMX050 10.34 Mp CMOS Image Sensor with Embedded Passives  Package Analysis Report (PKG-1005-802) Description: The IMX050CQK is provided in a package with a package area reduced by over 30% from that of... more...   Sony CXD4122GG CIS Processor  Process Node Assessment (PNA-1005-801) Description: Sony has now developed the CXD4122GG, a second-generation camera system IC for digital still cameras... more...   Sony IMX050 Second Generation BSI CMOS Image Sensor  Imager Process Review (IPR-1004-802) Description: The Sony IMX050 is a backside illuminated image sensor featuring 10.34M pixels wth a pixel size of... more...   Seiko S-8264A Battery Protection IC  Circuit Analysis Report (CAR-1005-906) Description: The S-8264A/B Series is used for secondary protection of lithium-ion rechargeable batteries, and... more...   Texas Instruments 1910-612M MEMS Digital Mirror Device  MEMS Process Report (MPR-1005-901) Description: The 1910-612M is a 16.9 mm diagonal pixel array, high definition (HD) format, spatial light... more...   Texas Instruments TMS320C6455 Digital Signal Processor DDR  Circuit Analysis Report (CAR-1004-201) Description: The Texas Instruments TMS320C6455ZTZ is a high performance fixed-point DSP designed for telecom,... more...   Texas Instruments DDP3021 Digital Light Processing ASIC  Process Node Assessment (PNA-1004-803) Description: The DDP3021 Digital Light Processing (DLP) ASIC is used withTexas Instruments digital mirror devices... more...   < Previous  Results 1-25 of 702   Next >